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Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces. Please note, we are working with a new submission system. In case you have questions regarding a submission made before February 2023, please access the system via the link provided to you in the submission confirmation email. We are currently preparing a special issue on Dielectric-Barrier Discharges and their Applications in commemoration of the 20th anniversary of Kogelschatz’s work. Found out more here. An international forum for fundamental research and new developments in plasma chemistry and plasma processing Offers fundamental plasma studies and studies of specific applications Covers plasma etching in microelectronics, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and more 96% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again
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Shi, JiaqiYan, XueqingHua, WeiChang, YingChang, Guang