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IEEE Transactions on Components, Packaging and Manufacturing Technology EI PubMed AJ SCIE 中科院3区 JCR:Q3 JCR:Q2
发文量 4,723
被引量 35,746
影响因子(2023) 1.390

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

  • 主办单位： IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
  • 出版地区： United States
  • 出版周期： 月刊
  • 别名： IEEE组件、包装与制造技术汇刊;IEEE transactions on components, packaging, and manufacturing technology
  • 国际标准连续出版物号： ISSN 2156-3950
  • 创刊时间： 2011年
  • 曾用名： IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
热门主题：

PackagingInformationManufacturing TechnologyTemperatureDesignDegreesManufacturingModelingReliabilityPresentsSolderIntegrationTransactionsExperimentalMagnetic MaterialsIntegratedElectrical and Electronic EngineeringManufacturing EngineeringAnalysisPackage

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