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Conductive AdhesivesElectronic PackagingPackaging TechnologiesRelaxation ModulusFinite Element MethodConductive AdhesivePackage DesignElectronic SystemsTime Temperature Superposition PrincipleIsotropically Conductive AdhesivesRelative HumidityThermally Conductive AdhesivesAnisotropic Conductive AdhesivesIsotropic Conductive AdhesiveDesign Optimization MethodologyFlip-chip InterconnectElectrically Conductive AdhesivesJet Array ImpingementTime-Dependent Dielectric BreakdownManifold Microchannel
vol.1 (1998)
vol.1 (1995)