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Multichip ModuleThick FilmFlip ChipElectronic PackagingElectrical PerformanceHigh DensityThin FilmKnown Good DieBall Grid ArrayLow Temperature Cofired CeramicThick Film TechnologyCoefficient of Thermal ExpansionThermal PerformanceBare DieAluminum NitrideWire BondingLow Temperature Cofired CeramicsHigh FrequencyFlip Chip TechnologySolder Joints
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