- 充值
- 会员
- 职称材料
文献信息
Surface Mount TechnologyElectrostatic DischargeSemiconductor ManufacturingChip on BoardProduct and Process DesignReflow Soldering ProcessCharged Device ModelPrinted Circuit BoardUnderfill MaterialsBall Grid ArrayStencil Printing of Solder PasteElectronics ManufacturingSn SolderReflow ProfileSolder JointsProcess ParametersSolder JointElectronic AssemblyPrinted Circuit Board AssembliesIntegrated Circuit
vol.21 (1998)
vol.20 (1997)
vol.19 (1996)