- 充值
- 会员
- 职称材料
文献信息
Simultaneous Switching NoiseSignal IntegrityTransmission LinesElectronic PackagingPrinted Circuit BoardPrinted Circuit BoardsMultichip ModuleTransmission LineFlip ChipDecoupling CapacitorsBall Grid ArrayTransient SimulationSolder JointSolder JointsCoefficient of Thermal ExpansionElectrical PerformanceMulticonductor Transmission LinesCoplanar WaveguideCircuit SimulationAdvanced Packaging
vol.33 (2010)
vol.32 (2009)
vol.31 (2008)
vol.30 (2007)
vol.29 (2006)
vol.28 (2005)
vol.27 (2004)
vol.26 (2003)
vol.25 (2002)
vol.24 (2001)
vol.23 (2000)
vol.22 (1999)
El-Moselhy, TarekElfadel, Ibrahim M.Daniel, Luca