IEEE Transactions on Components, Packaging and Manufacturing Technology

美国

发文量 3,639

被引量 59,776

影响因子(2025版) 2.374

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.

主办单位： IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
出版地区： PISCATAWAY
出版周期：年12期
别名： IEEE T COMP PACK MAN;IEEE Trans. Compon. Pack. Manuf. Technol.;IEEE Transactions on Components, Packaging & Manufacturing Technology;IEEE Transactions on Components Packaging and Manufacturing Technology;IEEE Transactions on Components, Packaging, and Manufacturing Technology;IEEE组件、包装与制造技术汇刊;IEEE transactions on components, packaging, and manufacturing technology;IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

国际标准连续出版物号/电子版： ISSN 2156-3950 / EISSN 2156-3985
创刊时间： 2011年
曾用名： IEEE transactions on advanced packaging,IEEE transactions on components and packaging technologies,IEEE transactions on electronics packaging manufacturing

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