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IEEE Transactions on Power Electronics 中科院1区 JCR:Q1 SCIE EI IEEE PubMed JST
发文量 18,571
被引量 1,271,130
影响因子(2025版) 6.179

The IEEE Transactions on Power Electronics (TPEL) covers all issues in the field of power electronics, including conversion, control, applications, conceptual issues, and system integration of electric power using semiconductors and switching devices. The focus of this journal encompasses power converters including components and system integration for their applications. This journal publishes works involving techniques and methodologies on modeling and simulation, analysis, design, fabrication, testing and characterization, evaluation and validation, and applications of power-electronic components, converters, converter systems, and system integrations. Review, tutorial, and survey articles with a viewpoint on the state-of-the-art and future technological advances are also welcome.

  • 主办单位: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
  • 出版地区: PISCATAWAY
  • 出版周期: 年12期
  • 别名: IEEE T POWER ELECTR;IEEE Trans. Power Electron.;IEEE电力电子学汇刊;IEEE TRANSACTIONS ON POWER ELECTRONICS
  • 国际标准连续出版物号/电子版 ISSN 0885-8993 / EISSN 1941-0107
  • 创刊时间: 1986年
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期刊信息

  • 主办单位:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
  • 主  编:Xiongfei Wang;Maryam Saeedifard
  • 地  址: PISCATAWAY
  • 电子邮件: peleditor@ieee.org(Chief Editor,Xiongfei Wang);PELletters@ieee.org(Chief Editor,Maryam Saeedifard)

期刊简介

The IEEE Transactions on Power Electronics (TPEL) covers all issues in the field of power electronics, including conversion, control, applications, conceptual issues, and system integration of electric power using semiconductors and switching devices. The focus of this journal encompasses power converters including components and system integration for their applications. This journal publishes works involving techniques and methodologies on modeling and simulation, analysis, design, fabrication, testing and characterization, evaluation and validation, and applications of power-electronic components, converters, converter systems, and system integrations. Review, tutorial, and survey articles with a viewpoint on the state-of-the-art and future technological advances are also welcome.