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IEEE Transactions on Signal and Power Integrity
EI IEEE
The IEEE Transactions on Signal and Power Integrity publishes research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design. Advances in theory, algorithms, design approaches and modeling for ensuring the fidelity and performance of digital, analog, and hybrid electronic systems and sub-systems are considered.
- 主办单位： Institute of Electrical and Electronics Engineers
- 出版周期： 年刊
热门主题：
Signal IntegrityPrinted Circuit BoardsPower Distribution NetworkPower IntegrityThree Dimensional Integrated CircuitsScattering ParametersElectric Power TransmissionElectric Power DistributionCapacitor BankIntegrated Circuit InterconnectionsDecoupling CapacitorElectric LinesPrinted Circuit BoardPartial Element Equivalent CircuitElectromagnetic CompatibilityPower SupplyTime Domain AnalysisVoltage Regulator ModuleHigh-speed ChannelPulse Amplitude Modulation
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