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Flip ChipBall Grid ArraySolder JointElectrical PerformanceSolder JointsFlip Chip AssemblyThick FilmUnderfill MaterialsPlastic Ball Grid ArrayChip Scale PackagePrinted Circuit BoardElectronic PackagingPackaging TechnologyCoefficient of Thermal ExpansionHigh DensityAssembly ProcessIntegrated CircuitsSmall Form FactorPackage DesignPackage Reliability