• 充值
  • 会员
  • 职称材料
搜期刊
刊名

文献信息

  • 任意字段
  • 主题词
  • 篇关摘
  • 篇名
  • 关键词
  • 摘要
  • 作者
  • 第一作者
  • 作者单位
  • 刊名
  • 中图分类号
  • 学科分类号
  • DOI
  • 基金
文献检索

美国
投稿预审
IEEE Transactions on Components, Packaging and Manufacturing Technology 中科院3区 JCR:Q3 JCR:Q2 SCIE EI IEEE PubMed JST
发文量 3,639
被引量 60,096
影响因子(2025版) 2.374

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.

  • 主办单位： IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
  • 出版地区： PISCATAWAY
  • 出版周期： 年12期
  • 别名： IEEE T COMP PACK MAN;IEEE Trans. Compon. Pack. Manuf. Technol.;IEEE Transactions on Components, Packaging & Manufacturing Technology;IEEE Transactions on Components Packaging and Manufacturing Technology;IEEE Transactions on Components, Packaging, and Manufacturing Technology;IEEE组件、包装与制造技术汇刊;IEEE transactions on components, packaging, and manufacturing technology;IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
  • 国际标准连续出版物号/电子版： ISSN 2156-3950 / EISSN 2156-3985
  • 创刊时间： 2011年
  • 曾用名： IEEE transactions on advanced packaging,IEEE transactions on components and packaging technologies,IEEE transactions on electronics packaging manufacturing
热门主题：

Signal IntegrityPrinted Circuit BoardHeterogeneous IntegrationThermal ResistanceBandpass FilterSolder JointsSolder JointBall Grid Arraythrough Silicon ViaContact ResistanceCoefficient of Thermal ExpansionIntegrated Circuit InterconnectionsIntegrated CircuitsElectronic PackagingFinite Element ANALYSISPrinted Circuit BoardsElectronics PackagingSubstrate Integrated WaveguidePower Distribution NetworkTransmission Lines

收录汇总 栏目浏览 期刊详情
收录汇总
出版文献
期刊详情
新发布(2025版)
分析评价
  • 1
  • 2
目录
封面
2024年4期
共：21篇
  • 1
  • 2
2024年4期

2024年4期

客服咨询
投稿相关：023-63416211
撤稿相关：023-63012682
查重相关：023-63506028
重庆维普资讯有限公司 渝B2-20050021-1 渝公网备 50019002500403
违法和不良信息举报中心   举报邮箱：jubao@cqvip.com   互联网算法推荐专项举报：sfjubao@cqvip.com    网络暴力专项举报: bljubao@cqvip.com
网络出版：（署）网出证（渝）字第014号    出版物经营许可证：新出发2018批字第006号