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Solder JointElectronic PackagingLow Temperature Cofired CeramicsSolder JointsLow Temperature Cofired CeramicHeterogeneous IntegrationLead-free SolderCoefficient of Thermal ExpansionPrinted Circuit BoardThermal ResistanceMicroelectronicsLTCCBall Grid ArrayFlip ChipPlastic Ball Grid ArrayPrinted Circuit BoardsLTCC SubstratesDesign of ExperimentFinite Element ModelingElectronics Packaging
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