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Solder JointElectronic PackagingLow Temperature Cofired CeramicHeterogeneous IntegrationLow Temperature Cofired CeramicsSolder JointsLead-free SolderCoefficient of Thermal ExpansionPrinted Circuit BoardThermal ResistanceMicroelectronicsLTCCFlip ChipBall Grid ArrayPlastic Ball Grid ArrayPrinted Circuit BoardsLTCC SubstratesDesign of ExperimentFinite Element ModelingElectronics Packaging